Market Research Future (MRFR) asserts that the flexible printed circuit board market is poised to garner a significant value by 2027, growing at a colossal CAGR during the assessment period (2020–2027).
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Global Flexible Printed Circuit Board (FPCB) Market – Regional Analysis
The Asia Pacific region dominates the global Flexible Printed Circuit Board Market Share. The rapid uptake of advanced technologies and investments in designing flexible printed circuit boards drive regional market growth. China, India, and Japan are major markets for FPCB technologies, witnessing rising high demand.
Besides, rapidly growing industries, such as consumer electronics, manufacturing, aerospace & defense, medical devices, automotive, and wearables, substantiate the region's market size. Moreover, the presence of major electronic players increases the region's market share, allowing the early adoption of innovative, flexible technologies.
Flexible Printed Circuit Board Market – Segments
The report is segmented into types, application areas, and regions. The type segment is sub-segmented into multilayer flex, rigid-flex, double-sided flex, and single-sided flex. The application area segment is sub-segmented into consumer electronics, manufacturing, aerospace & defense, medical devices, automotive, wearables, and others. The region segment is sub-segmented into Americas, Europe, APAC, and the Rest-of-the-World.
Global Flexible Printed Circuit Board (FPCB) Market – Competitive Analysis
Highly competitive, the FPCB market appears fragmented due to the presence of several well-established players. Mergers & acquisitions, innovation, and brand reinforcement remain prevailing key trends for the leading players as these strategies support their growth and expansion plans.
Market Players
Players leading the FPCB market include Zhen Ding Tech, Nitto Denko Corporation, bhflex Co. Ltd., Career Technologies, Interflex Co. Ltd., MFS Technology, Daeduck GDS Co. Ltd., Sumitomo Electric Industries Ltd., Flexible Circuit, and Fujikura Ltd., among others.
Industry/ Innovation/ Related News
May 03, 2021 --- Samsung Electro-Mechanics announced that it is to supply rigid-flexible printed circuit boards (RFPCB) to Apple for its next-gen high-end iPhones with LPTO displays. RFPCBs are used to connect the OLED panel with the mainboard. Apple is planning to use RFPCB for the two higher-tier models in the new iPhone, while the remaining two models will use multiplex FPCB.
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